Through-hole technology refers to the mounting scheme used for electronic
RoHS compliant means that the component does not contain six hazardous substances .
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits
This is where high-quality LEDs paired with good thermal management and robust
Base metals in the MCPCB are used as an alternative to FR4 or CEM3 boards for the ability to dissipate heat
