Dependable EMS partner

Dependable EMS partner

Our Services

Through hole and SMD

Through-hole technology refers to the mounting scheme used for electronic

RoHS & non RoHS

RoHS compliant means that the component does not contain six hazardous substances .

Ball Grid Array Assembly

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits

LED driver design & manufacturing

This is where high-quality LEDs paired with good thermal management and robust

Metal Core PCB & LED Assemblies

Base metals in the MCPCB are used as an alternative to FR4 or CEM3 boards for the ability to dissipate heat

Our Portfolio

“Their motivation and direction.”

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enquiry@micronems .com
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+91 9448032255